Photolithography capabilities(光刻能力) | 内容 |
---|---|
Equipment Model(设备型号) |
i-Line 365nm, contact lithography for double-sided alignment i-Line 365nm,接触式光刻,可实现双面对准 |
Wafer size(晶圆尺寸) |
6" Round, 6" Square, 8" Round 6” 圆、6” 方、8” 圆 |
Resolution(最小分辨率) | 4um @line/space |
Alignment accuracy (TSA)(套刻精度(TSA)) | ≤1μm |
Alignment accuracy (BSA)(套刻精度(BSA)) | ≤1.5μm |
Product Size(产品尺寸) | 内容 |
Material(材料) |
Optical glass, silicon wafers, sapphire, etc. 光学玻璃、硅片、蓝宝石等 |
Microstructure size(微结构尺寸) | Min 5μm @line space |
Dimensional accuracy(尺寸精度) | ±2 um @ 8inch wafer |
Dimensional Uniformity(尺寸均匀性) | ≤5% |
Optical performance(分光特性) | 内容 |
Optical coating | 540/575/615/660/710nm,FWHM ≦40nm,Tmax>60% |